 |
JH-5050W12S40-T8A-A
LEDGUHON
| Quantity: | |
|---|---|
Features:
• Well-known chip material, Sanan
• 99.99% gold wire bonding
• High flux per LED
• Industry best moisture sensitivity
• Low-temp & lead-free reflow soldering
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light(less than 100ns)
Data:
| Parameter | Symbol | Color | Min | Type | Max | Unit | Test Condition |
| Forward Voltage | VF | White | 3.2 | 3.4 | 3.6 | V | IF=700mA |
| Luminous Flux | White | 250 | 260 | 270 | LM | IF=700mA | |
| Color Temperature | TC | White | 6000 | 6500 | 7000 | K | IF=700mA |
| Reverse Current | IR | ||||||
| Viewing Angle | 1/2 | 120 | Deg | IF=700mA | |||
| Recommend Forward Current | IF(rec) | White | 700 | mA |
Precautions:
• Pressure on the LEDs will influence the reliability of the LEDs. Precautions should be taken to avoid intense pressure on the LEDs. Do not put stress on the LEDs during heating.
• Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair.
• Do not stack assembled PCBs together. Since the materials of LEDs are soft, abrasion between two PCBs assembled with LED might cause catastrophic failure of the LEDs.
Features:
• Well-known chip material, Sanan
• 99.99% gold wire bonding
• High flux per LED
• Industry best moisture sensitivity
• Low-temp & lead-free reflow soldering
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light(less than 100ns)
Data:
| Parameter | Symbol | Color | Min | Type | Max | Unit | Test Condition |
| Forward Voltage | VF | White | 3.2 | 3.4 | 3.6 | V | IF=700mA |
| Luminous Flux | White | 250 | 260 | 270 | LM | IF=700mA | |
| Color Temperature | TC | White | 6000 | 6500 | 7000 | K | IF=700mA |
| Reverse Current | IR | ||||||
| Viewing Angle | 1/2 | 120 | Deg | IF=700mA | |||
| Recommend Forward Current | IF(rec) | White | 700 | mA |
Precautions:
• Pressure on the LEDs will influence the reliability of the LEDs. Precautions should be taken to avoid intense pressure on the LEDs. Do not put stress on the LEDs during heating.
• Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair.
• Do not stack assembled PCBs together. Since the materials of LEDs are soft, abrasion between two PCBs assembled with LED might cause catastrophic failure of the LEDs.
